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Hyperscooter, day three: our own 300 W DC-DC — before the first solder joint

Day three of the Hyperscooter — a scooter we are designing from scratch: our own frame, our own suspension, our own controllers. On this day it got the module that will power everything on board except the motors: headlights, lights, horn, a phone socket and the head unit on the handlebar. This entry is how we designed it and what we know about it so far — from calculation only.

How much is needed

We started with the list of loads. The biggest one is not the headlights but the USB-C PD socket for a phone and a laptop.

We sized the module for 25 A at 12 V, which is 300 W: with headroom for a pump and fans, should they be needed.

And one more condition on top: one module for two scooters. The Ninebot G30 has a 16S battery, the big one has 24S. So the input spans from an empty 16S to a full 24S with regenerative braking.

Why 150 volts

Regenerative braking on the big scooter can push the bus up to 115 V — the cut-off we proposed for the controllers. And the switch node rings above the input on every cycle, by 10–20 V even with a good layout (estimate).

A 120 V part leaves 5 V of margin above regen — less than the ringing. We need the 150 V class: then 35 V are left for ringing.

We took the ADI LTC7810: input up to 140 V, 150 V absolute maximum, two channels that can be combined into two phases driving one output. Its datasheet has a reference design that is almost our task — 12 V / 30 A from 8–140 V — and that is where we started.

A reference design is not a finished design

Two phases shifted by 180° split the current in half: less ripple at the input and output, and the heat is spread over four MOSFETs and two inductors.

We did not copy the ADI reference design one to one: in four places it does not fit us.

With the original MOSFETs, diode recovery at 115 V would cost ~8.9 W on each low-side switch. ADI uses the BSC093N15NS5 in another of its reference designs, for inputs up to 140 V.

Losses

We calculated losses with the equations from the LTC7810 datasheet, MOSFETs hot. MOSFET output charge and diode recovery are taken with a margin on the high side.

The higher the input, the more heat: the voltage-dependent losses grow — high-side switching, recharging its capacitance, diode recovery. The hottest spots are the low-side MOSFETs: each takes about a quarter of the module's total loss.

Protection

The module has no microcontroller of its own, so everything it does in a fault is done in hardware.

The board: reworked by the checklist

The board is 108 × 80 mm, 4 layers. Schematic and board are generated by Python scripts in KiCad, signal traces are routed by Freerouting, power copper and tricky connections by our own script.

The first placement looked neat: each phase under its own inductor, everything symmetrical. An outside reviewer sent comments on the layout, we re-read the checklist at the end of the datasheet — and found we broke its very first item.

3D view of the DC-DC board: two large inductors in the middle, output capacitor cans on the right, input electrolytic and fuse on the left
Rev A in 3D: inductors side by side, MOSFETs between and below them
Top copper layer: power islands for input, switch nodes and output, controller IC at the bottom centre
Top layer: power copper islands

Heat: the calculation found the problem before the order

The module lives in a sealed enclosure: IPX9K and IPX7, no fan. Heat leaves through the floor into the aluminium plate of the frame.


Section of the module enclosure: the board, components up, sits on a raised floor pad through a thermal pad; tall electrolytic on the right, cable glands on the sides
Enclosure sketch in section: the board sheds heat down into the raised floor pad

You cannot get this from a single watts-to-degrees number, so we built a model from the board's actual copper: a 0.5 mm grid over four layers, copper conducts only within its own net, and between layers there is fibreglass and via walls.


Two thermal maps of the top copper layer: on the left the low-side drain is 123 K above the floor, on the right with VIPPO 66 K; the NTC sensors barely warm up
Top copper above the enclosure floor, 24S and 25 A. Right: with vias in the drain pads and the switch node moved to the bottom layer

Vias next to the MOSFET do not help: heat does not reach them through thin copper. Only vias right in the drain pad, filled and capped with copper — VIPPO — do. We are finding out what the board house charges for it; the decision for Rev A is still open.

The dock handles overheating

Each phase has an NTC sensor next to the low-side MOSFET, both routed to the connector. The module itself does not know which load matters more — the dock of the head unit on the handlebar does. It reads the temperature, reports it to diagnostics and sheds load in steps.

The lights are never turned off — the owner's decision: on the move they matter more than an intact board. With only the lights on, the module delivers ~90 W and loses almost half as much as at full load.

How much of this is true

We asked ourselves this before publishing. The answer differs from number to number.

The next entry about the module will come from the bench: efficiency at several points, a thermocouple on the low-side MOSFET, a scope trace of the switch node at 115 V, and a comparison with this article — where we were right and where we were not.

What exists now

  • Rev A schematic and board: KiCad checks pass clean, 58 parts.
  • Loss calculation and the thermal model from the board copper — as scripts, recalculated on every board change.
  • Enclosure sketch: a machined aluminium tub, floor down on the frame plate.
  • A module datasheet and a schematic description for review.

Your own hardware — from calculation to bench
Start with the brief: four questions and an honest answer on whether we are a good fit.
Take the brief